NexPlanar Receives $10,118,650 New Funding
- Feed Type
- Link
http://www.venturedeal.com/Search/SearchResultTransactionDetail.aspx?TransactionId=82f83d37-f3ce-47ad-8bb4-a57a0cf50d9e&Preview=1 - Date
3/31/2011 - Company Name
NexPlanar - Mailing Address
7425 NW Evergreen Parkway Hillsboro, OR 97124 - Company Description
NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. Our propriety nano-domain technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life. - Website
http://www.nexplanar.com - Transaction Type
Venture Equity - Transaction Amount
$10,118,650 - Transaction Round
Undisclosed - Proceeds Purposes
Proceeds purposes were not disclosed. SEC regulatory filing. - M&A Terms
- Venture Investor
Undisclosed
