NexPlanar Lands $3,500,000 New Funding
- Feed Type
- Link
http://www.venturedeal.com/Search/SearchResultTransactionDetail.aspx?TransactionId=d3629f88-0ece-48ac-85a8-bc062a9b2d42&Preview=1 - Date
3/30/2010 - Company Name
NexPlanar - Mailing Address
7425 NW Evergreen Parkway Hillsboro, OR 97124 - Company Description
NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. Our propriety nano-domain technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life. - Website
http://www.nexplanar.com - Transaction Type
Debt - Transaction Amount
$3,500,000 - Transaction Round
Undisclosed - Proceeds Purposes
The financing will be used for capacity expansion to support increased customer demand. - M&A Terms
- Venture Investor
Atel Ventures, Inc.
