LendKey Secures $8,000,000 New Financing Round

  • Feed Type
  • Date
  • Company Name
  • Mailing Address
    104 W. 27th St. 4th Floor New York, NY 10001 USA
  • Company Description
    LendKey offers cloud-based technology to provide the essential infrastructure for financial institutions or any party to quickly, securely, efficiently, and profitably lend to anyone else – from those offering loans directly to those structuring new types of loans.
  • Website
  • Transaction Type
  • Transaction Amount
  • Transaction Round
  • Proceeds Purposes
    Proceeds purposes were not disclosed by the company.
  • M&A Terms
  • Venture Investor

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One response to “LendKey Secures $8,000,000 New Financing Round”

  1. Jon Walters says:

    We are laying off a ton of people in NYC and Ohio on Thursday June 18 2015